A researcher from Keio University in Japan showed a way to put an entire solid-state disk in the footprint of a single chip in an evening talk at the International Solid State Circuits Conference (ISSCC) here.
Keio researchers used inductive coupling to link a stack of 128 NAND flash die and a controller. The wireless interface grabbed the attention of engineers at a late-night ISSCC session on energy efficient interfaces. The session ranged across a wide territory, covering work in optical chip interfaces and data centers interconnects.
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