Intel Corp. is still exploring the future use of 3-D devices based on through-silicon vias (TSVs), but the company said that it has still not found the right application or “product intercept” for the technology.
Right now, chip makers are shipping limited 3-D devices based on TSVs, mainly CMOS image sensors, MEMS, and, to some degree, power amplifiers. But for years, IBM, Intel and others have been looking at stacking microprocessors, memory and other functions using TSV technology.
Experts define a true 3-D package as one that stacks various chips vertically and then connects them by deploying TSVs. The aim is to shorten the interconnections between the chips, reduce die sizes and boost device bandwidths.
