By Jacob Borgeson
The level of innovation in companies throughout the supply chain has increased significantly in the past few months. Engineers are now turning their attention away from marginal improvements that were designed to keep products coming out in the pipeline to more long-term achievements that can bring a new paradigm to the market.
Many end equipment manufacturers look to chip manufacturers for the basic technological leaps that will enable the next generation of products. This series of articles will look at three significant trends emerging in one of the most critical and competitive sockets in modern electronic systems, including: nonvolatilve memory, hyperintegration and new packaging approaches. First we’ll look at non-volatile memory.
