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NEC, Toshiba expand efforts in IBM ‘fab club’

June 19th, 2009 · No Comments




The 28-nm process race is heating up. Japan’s NEC Electronics Corp. and Toshiba Corp. have extended their technology development agreements with IBM Corp. to participate in the development of a 28-nm process with high-k and metal gates.

Toshiba joined IBM’s semiconductor process technology development alliance in December 2007 and NEC Electronics joined in September 2008. Now, NEC Electronics and Toshiba will extend its efforts in IBM’s technology alliance to develop a 28-nm bulk complementary metal oxide semiconductor (CMOS) process technology.

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Tags: Chip Tech

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