by Steve Carlson
Moore’s Law has become an industry-wide challenge – our de facto industry promise to pursue integration as far as physics and a reasonable cost structure will allow. This should continue for many years, if we can meet and collaboratively overcome some key challenges in power consumption, manufacturability, and complexity.
Generally speaking, however, as feature sizes get smaller, problems get proportionately bigger. Problems like signal integrity, crosstalk, defects, proximity effects, timing delays, thermal effects, leakage, packaging, copper pooling, and pattern fidelity.
