NEC Electronics Europe has introduced its package HSON-8 for power semiconductors in automotive applications. The device offers similar performance as widespread packages at lower space requirements.
The package combines the small footprint of as a SOP-8 package with the thermal and electrical properties of a DPAK (aka TO-252) package, NEC claims. Thus, the footprint for power semiconductors can be reduced by 50 percent. This is of particular interest in applications where space is limited such as ABS and fuel injection systems. Despite its smaller size, HSON-8 devices are pin compatible with comparable products from competitors, a NEC Europe spokesperson explained.