Several entities, including IBM Corp. and Intel Corp., are exploring a new technology called co-polymer lithography in an effort to extend Moore’s Law.
Scientists at the University of California at Santa Barbara (UCSB) and the National Science Foundation (NSF) have also made a major contribution to this field. UCSB claims to have developed a novel, self-assembly process for creating features on silicon that are between 5- and 20-nm.
Intel, IBM, UCSB and NSB funded the R&D. The university has already applied for patents on the new methods and it will retain ownership.
