The next major advance in computer processors will likely be the move from today’s two-dimensional chips to three-dimensional circuits, and the first three-dimensional synchronization circuitry is now running at 1.4 gigahertz at the University of Rochester.
Unlike past attempts at 3-D chips, the Rochester chip is not simply a number of regular processors stacked on top of one another. It was designed and built specifically to optimize all key processing functions vertically, through multiple layers of processors, the same way ordinary chips optimize functions horizontally. The design means tasks such as synchronicity, power distribution, and long-distance signaling are all fully functioning in three dimensions for the first time.
